Aluminum Bonding Wire 0.7 to 3 mil (Fine Wire)
Only the highest purity materials are used to manufacture K&S fine aluminum wire. These products exhibit excellent mechanical stability and are available in both standard (Al/Si 1%) and corrosion resistant (AlMgPd) types.

High Performance Gold Wire4N Wire
Superior Performance for Your Toughest Applications
FP2 (99% pure) gold ball bonding wire exhibits very high tensile strength, making it a wise choice for use in high density, CSP, QFP and advanced BGA packages.

High Performance Gold Wire4N Wire
Superior Performance for Your Toughest Applications
FP2 (99% pure) gold ball bonding wire exhibits very high tensile strength, making it a wise choice for use in high density, CSP, QFP and advanced BGA packages.

RADIX™ series Gold Bonding Wire for superior ball bond reliability.
RADIX Series wires provide ultimate intermetallic stability on your most demanding applications, including  low-K, bonding over active circuitry, ultra fine pitch processes, and stacked die.

Formax™ Gold Wire for Stacked Die and Multi-tier Applications
Gold Bonding Wire for highly accurate and consistent loop profiles and higher wire bond yields on all types of stacked-die and multi-tier applications.

Wedge Bonding Gold Wire For consistent low loop profiles
K&S wedge bonding wire has been engineered to achieve low, consistent loop profiles for consistent impedance in high frequency applications. It exhibits excellent bondability on the widest range of semiconductor materials and contact metallizations, as well as substrate metallizations. Superior tail consistency rounds out the capabilities of this very versatile bonding wire.   

Stud Bumping Gold Wire  For all types of bumping applications
K&S gold stud bumping wire provides versatility for all types of bumping applications including standard stud, coined, and stacked bumps. Available in either 2N or 4N compositions, it delivers consistent bump height and long-term bond stability.

4N Wire
The AW 66 & AW99 product family delivers maximum bonding robustness and high reliability. Our newest additions - AW66i & AW99i - are specially engineered for all types of Stacked Die applications.

Wedge Bonding Tools
K&S manufactures a complete line of standard and custom wedge tools to fit all applications down to 50um and all types of wedge bonding machines. Wedge tools are available in a variety of materials, such as tungsten carbide for aluminum wire applications, titanium carbide for gold wire wedge bonding and fine grain metals for fine pitch applications.

Capillary
Standard (STD) Capillary Bonding
Standard bonding accounts for approximately 30-40% of all bonding done today. Standard bonding is usually appropriate for applications of 120 um pad pitch and above. Standard applications encompass 1-2 wire devices such as Descrete, as well as more complex devices containing up to 64 wires.