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MICRO POINT PRO

Micro Point Pro Ltd (MPP) is a leading customized solutions provider for the semiconductor and other micro-electronic devices assembly industries. MPP applies over 40 years of experience and expertise in the design and manufacturing of micro tools and other customized tools for broad range of applications, providing end-to-end solutions to wide array of clients, some of them are market leaders in their respective fields. We at MPP are committed to support you with the Best Cost Performance Solution in terms of: Quality, Precision, Accuracy, Repeatability, Life Span, Delivery Time and Local Support, which together enables you the Lowest Operational Cost.

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MICRO POINT PRO - Die Attach Tools

Die Attach Tools

The Die Bonding process takes place prior to wire bonding. The selected die is placed in a package a
MICRO POINT PRO - SJB Capillary

SJB Capillary

Solder Jet Bonding (SJB) is now the standard technology to support HDD requirements Beside the comm
MICRO POINT PRO - Fine Wire Wedge Bonding Tools

Fine Wire Wedge Bonding Tools

MPP Fine Wire Wedges range from fine pitch wedges to Ultra Fine Pitch Wedges (35 um pitch with a 20
MICRO POINT PRO - Ribbon Wire Wedge Bonding Tools

Ribbon Wire Wedge Bonding Tools

The Fine Wire wedge models designed to fit applications using ribbon wires, feature a rectangular ho
MICRO POINT PRO - Heavy Wire Wedge Bonding Tools

Heavy Wire Wedge Bonding Tools

Large wire is usually considered to range from about 75 or 100 um to over 500 um in diameter (3-20 m